
Manufacturer
Model
Conveyor speed [mm/sec]
Conveyor height [mm]
Board warp
Volume repeatability on a
certification target
Volume repeatability on a
circuit board
Gage R&R
Measurement types
CyberOptics
SE 300 Ultra 150 - 450 889 - 990
<2% of PCB
diagonal or
6.35mm
total
height, area,
volume, registration,
bridge detection
CyberOptics
SE 500 150 - 450 810 - 970
<2% of PCB
diagonal or
6.35mm
total
< 1%; 3 σ <3%; 3 σ << 10%; 6 σ
height, area,
volume, registration,
bridge detection
CyberOptics
SE 500-X 150 - 450 810 - 970
<2% of PCB
diagonal or
6.35mm
total
< 1%; 3 σ <3%; 3 σ << 10%; 6 σ
height, area,
volume, registration,
bridge detection
aSPIre n.a. 830 - 970 ± 5.0 mm < 1%; 3 σ <3%; 3 σ << 10%; 6 σ
height, area,
volume, offset,
bridge detection,
shape deformity
KY-8030 n.a. 870 - 970 ± 3.5 mm < 1%; 3 σ <3%; 3 σ << 10%; 6 σ
height, area,
volume, offset,
bridge detection,
shape deformity
Marantz
Power Spector n.a. 830 - 970 ± 5.0 mm n.a. n.a. n.a.
height, area,
volume, offset,
bridge detection,
shape deformity
Omron
VT-RNS-P n.a. n.a. n.a. n.a. n.a. n.a.
presence of solder,
insufficient solder,
excessive solder,
solder shifting,
grazing, bridging,
spreading
Omron - CKD
VP5000L n.a. n.a. n.a. n.a. n.a. n.a.
average height,
volume, excessive
deposition,
insufficient solder,
smearing,
misalignment,
bridging
Orpro Vision
Symbion P36 n.a. 870 - 930
Saki
BF-SPIder-M n.a. max. 900 n.a. < 1%; 3 σ n.a. < 10%
height, area,
volume, shift, shape,
spread, bridge
Saki
BF-SPIder-L n.a. max. 900 n.a. < 1%; 3 σ n.a. < 10%
height, area,
volume, shift, shape,
spread, bridge
n.a. n.a. n.a. n.a. n.a. n.a. n.a.
TRI Innovation
TR7006/L/LL-20 n.a. n.a. n.a. n.a. n.a. n.a. n.a.
TRI Innovation
TR7006/L/LL-16 n.a. n.a. n.a. n.a. n.a. n.a. n.a.
TRI Innovation
TR7006/L/LL-12 n.a. n.a. n.a. n.a. n.a. n.a. n.a.
TRI Innovation
TR7066-20 n.a. n.a. n.a. n.a. n.a. n.a. n.a.
TRI Innovation
TR7066-16 n.a. n.a. n.a. n.a. n.a. n.a. n.a.
TRI Innovation
TR7066-12 n.a. n.a. n.a. n.a. n.a. n.a. n.a.
Viscom
S3088-II QS n.a. 850 - 960 n.a. n.a. n.a. n.a. n.a.
Vi Technology
3D-SPI n.a. max. 950 ± 3.5 mm n.a. n.a. < 10%
height, area,
volume, bridge,
shape, position
Table 3. Comparison of Solder Paste Inspection (SPI) machines
Materials Science - Advanced Topics394
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