D-MAX DMC-20SEC Manual de usuario Pagina 55

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[193] Akira Kusano, Takashi Watanabe, Takuma Funahashi, Takayuki Fujiwara, Hiroyasu
Koshimizu, 3D Inspection of Electronic Devices by Means of Stereo Method on Single
Camera Environment, Proceedings of the Industrial Electronics (IECON), 2008, pp.
3391-3396
[194] Sheng Liu, Dathan Erdahl, I. Charles Ume, Achyuta Achari, Juergen Gamalski, A
Novel Approach for Flip Chip Solder Joint Quality Inspection: Laser Ultrasound and
Interferometric System, IEEE Transactions On Components and Packaging Technolo‐
gies, Vol. 24, No. 4, December 2001, pp 616-624
[195] Grantham K.H. Pang, Ming-Hei Chu, Automated Optical Inspection of Solder Paste
based on 2.5D Visual Images, Proceedings of the IEEE International Conference on
Mechatronics and Automation, 2009, pp 982-987
[196] Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Tsuzaka, Hiroshi Fujit, Automat‐
ed Solder Inspection Technique for BGA-Mounted Substrates by Means of Oblique
Computed Tomography, IEEE Transactions on Electronics Packaging Manufactur‐
ing, Vol. 30, No. 4, October 2007, pp. 285-292
[197] Jun Cheng, Chi-Kit Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung, Fan Wang,
W. H. Leung, Structured-Light Based Sensing Using a Single Fixed Fringe Grating:
Fringe Boundary Detection and 3-D Reconstruction, IEEE Transactions on Electronics
Packaging Manufacturing, Vol. 31, No. 1, January 2008, pp. 19-31
[198] Yunxia Gao, Jun Wang, Testing Failure of Solder-Joints by ESPI on Board-Level Sur‐
face Mount Devices, Proceeding of the International Conference on Electronic Pack‐
aging Technology & High Density Packaging (ICEPT-HDP), 2009, pp. 1256-1259
Automatic Optical Inspection of Soldering
http://dx.doi.org/10.5772/51699
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