D-MAX DMC-20SEC Manual de usuario Pagina 43

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[19] Keith Fairchild, Evaluating ROI of AXI vs. AOI, Circuits Assembly, October 2006, pp.
20-25
[20] “Realising Expectations of AOI http://www.dataweek.co.za/news.aspx?pklNew‐
sId=30534&pklCategoryID=4914, (accessed 03 July 2009)
[21] David Doyle, Challenges for Second Generation Automated Optical Inspection (AOI)
Solutions
[22] K C Fan, C Hsu, Strategic Planning of Developing Automatic Optical Inspection
(AOI) Technologies in Taiwan, 7th International Symposium on Measurement Tech‐
nology and Intelligent Instruments, Journal of Physics, Conference Series 13, 2005,
pp. 394-397
[23] Peter Krippner, T&M, Zero-defect IC Inspection Strategy With AOI, 2006 Electronics
Manufacturing, March 2006, http://www.emasiamag.com/currentIssue.asp?
d=1&m=3&y=2006# (accessed 12 July 2009)
[24] Mukul Shirvaikar, Trends in Automated Visual Inspection, Real-Time Image Proc‐
essing, Springer, 2006, 1:41–43
[25] Bob Ries, New Advances in AOI Technologies, Surface Mount Technology, January
2001, pp. 62-66
[26] Duncan Nicol, The Key (or Start Button) to Success, EPP Europe, November 2008, pp.
47-49
[27] Douglas W. Raymond, Dominic F. Haigh, Why Automated Optical Inspection, Inter‐
national Test Conference, 1997, pp. 1033
[28] Pamela Lipson, To Be or Not to Be in Color:A 10 Year Study of the Benefits and Pit‐
falls of Including Color Information in AOI Systems, Proceedings of the IPC APEX
Technical Conference EXPO, 2009
[29] Pamela Lipson, Lyle Sherwood, The landscape of PCB Technology is Changing Rap‐
idly. How Will AOI Testing Keep Up?, Proceedings of the IPC APEX Technical Con‐
ference EXPO, 2009
[30] Teledyne,DALSA,http://www.teledynedalsa.com/public/dc/documents/
Image_Sensor_Architecture_Whitepaper_Digital_Cinema_00218-00_03-70.pdf (ac‐
cessed 12 July 2009)
[31] Teledyne DALSA Applications Set Imager Choices, Dalsa Aplication Note, http://
www.dalsa.com/public/corp/applications_set_imager_choices.pdf (accessed 12 July
2009)
[32] Dave Litwiller, CMOS vs. CCD: Maturing Techologies, Maturing Markets, Reprint
from the 2005 August issue of Photonics Spectra, Laurin Publishing
Automatic Optical Inspection of Soldering
http://dx.doi.org/10.5772/51699
429
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