[180] Dr. Kwangli Koh (Koh-Young), Eliminating False Calls With 3D AOI Technology,
EPP Europe, Issue 4, 2009, pp. 40-43
[181] Wei-Hung Su, Kebin Shi, Zhiwen Liu, Bo Wang, Karl Reichard, Shizhuo Yin, A
Large-Depth-of-Field Projected Fringe Profilometry Using Supercontinuum Light Il‐
lumination, Optics Express, Vol. 13, No. 3, February 2007, pp. 1025-1032
[182] Günther Wernicke, Matthias Dürr, Hartmut Gruber, Andreas Hermerschmidt, Sven
Krüger, Andreas Langner, High Resolution Optical Reconstruction of Digital Holo‐
grams, Fringe 2005, Session 4, 2005 pp. 480-487
[183] Liu Xiao-Li, Li A-Meng, Zhao Xiao-Bo, Gao Peng-Dong, Tian Jin-Dong, Peng Xiang,
Model-Based Optical Metrology and Visualization of 3-D Complex Objects, Optoe‐
lectronics Letters, Vol. 3, No.2, 15 Mar. 2007, pp. 115-118
[184] Marek Wegiel, Malgorzata Kujawinska, Fast 3D Shape Measurement System Based
on Color Structure Light Projection, Fringe 2005, Session 3, 2005, pp. 450-453
[185] Simon Davis, Lead-Free Inspection And Qualification With 3D AOI, OnBoard Tech‐
nology November 2005, pp. 54-57
[186] Zulki Khan, A Primer on AOI and AOT, Circuits Assembly, September 2006, pp.
38-41
[187] Dongwon Shin, Thomas R. Kurfess, Three-Dimensional Metrology of Surface Ex‐
tracted From a Cloud of Easured Points Using a New Point-to-Surface Assignment
Method: An Application to PCB-Mounted Solder Pastes, Precision Engineering Vol.
28, Issue 3, July 2004, pp. 302-313
[188] Tae-Hyeon Kim, Tai-Hoon Cho, Young Shik Moon, Sung Han Park, An Automated
Visual Inspection of Solder Joints Using 2D and 3D Features, Proceedings on the 3rd
IEEE Workshop on Applications of Computer Vision, 1996. pp. 110-115
[189] Deokhwa Hong, Hyunki Lee, Min Young Kim, Hyungsuck Cho, Jeon Il Moon, Sen‐
sor Fusion of Phase Measuring Profilometry and Stereo Vision for Three-Dimension‐
al Inspection of Electronic Components Assembled on Printed Circuit Boards,
Applied Optics, Vol. 48, No. 21, 20 July 2009, pp. 4158-4169
[190] S. S. Wong, K. L. Chan, 3D Object Model Reconstruction From Image Sequence Based
on Photometric Consistency in Volume Space, Pattern Analysis and Application, No‐
vember 2009, DOI 10.1007/s10044-009-0173
[191] Deokhwa Hong, Heechan Park, Hyungsuck Cho: Design of a Multi-Screen Deflec‐
tometer for Shape Measurement of Solder Joints on a PCB, Proceedings of the IEEE
International Symposium on Industrial Electronics (ISIE), 2009, pp 127-132
[192] Jiquan Ma, Solder Joint's Surface Recovery Based on Linear Hybrid Shape-From-
Shading, Proceedings of the Second Asia-Pacific Conference on Computational Intel‐
ligence and Industrial Applications (PACIIA), 2009, pp. 245-249
Materials Science - Advanced Topics
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